Published applications
- Tốc độ
- Trình giữ nhiệt
- Tường đôi
Existing OEM model reference
Use the published dimensions and construction below to identify a possible HEXNOVAS replacement. Thermal duty, connection type, design pressure, brazing material and refrigerant distribution must be confirmed before selection.
Published technical reference
Model-specific engineering review
KAORI D206 is recorded as copper-brazed double-wall construction, with a 246 × 528 mm envelope, 174 × 456 mm port centres and a published maximum pressure of 45 bar.
HEXNOVAS BL120 matches the listed dimensions but its candidate entry does not document double-wall construction. A matching envelope is therefore not evidence of an equivalent separation arrangement.
Port-centre measurements do not specify connection diameter, thread or flange standard. Confirm the complete installed configuration.
The reference context includes heat pumps, refrigeration and double-wall requirements. Do not transfer a double-wall requirement or the original equipment approval to a candidate on dimensional evidence alone.
Brazed plate construction and family overviewThe on-page drawing is a generated, not-to-scale identification schematic. Its dimensions come from the reference catalogue; its depicted plate/port geometry is not a certified manufacturing drawing.
KAORI D206 manufacturer product reference. Source revision/date is not recorded with this catalogue entry.
Request the reviewed model drawing and configuration-specific rating before manufacture or replacement.
Send the D206 nameplate, double-wall requirement and relevant equipment documents, connection details and both fluid duties. Identify the required construction and design limits before any replacement is proposed.
Construction and material compatibility reviewThird-party brand and model names are used solely to identify existing equipment and dimensional references. HEXNOVAS is an independent supplier and is not affiliated with or endorsed by those manufacturers. Dimensional similarity does not establish thermal, mechanical or connection equivalence.