Published applications
- Evaporador
- Condenador reversible
- Cascade
Existing OEM model reference
Use the published dimensions and construction below to identify a possible HEXNOVAS replacement. Thermal duty, connection type, design pressure, brazing material and refrigerant distribution must be confirmed before selection.
Published technical reference
Model-specific engineering review
The SWEP V25 reference is 116 × 524 mm, with 72 × 479 mm port centres. The source entry describes copper-brazed 316/316L plates with refrigerant distribution.
HEXNOVAS BL60 is the nearest dimensional candidate and shares the listed port centres, but the candidate record does not establish equivalent refrigerant distribution. That feature needs its own review.
Port-centre measurements do not specify connection diameter, thread or flange standard. Confirm the complete installed configuration.
Evaporator, reversible-condenser and cascade duties are recorded contexts for V25. The entry does not establish a particular refrigerant, circuit arrangement or pressure rating for an installed unit.
Brazed plate construction and family overviewThe on-page drawing is a generated, not-to-scale identification schematic. Its dimensions come from the reference catalogue; its depicted plate/port geometry is not a certified manufacturing drawing.
SWEP V25 evaporator product sheet. Source revision/date is not recorded with this catalogue entry.
Request the reviewed model drawing and configuration-specific rating before manufacture or replacement.
Send the V25 nameplate and configuration, refrigerants/secondary fluid, phase-change conditions, superheat/subcooling requirements, flows and allowable pressure drops. Include distribution and reversing-operation requirements where applicable.
Cascade heat-exchanger operating conditionsLas marcas y los modelos de terceros se citan únicamente para identificar equipos existentes y referencias dimensionales. HEXNOVAS es un proveedor independiente y no está afiliado ni cuenta con el respaldo de esos fabricantes. Dimensional similarity does not establish thermal, mechanical or connection equivalence.