Industry application

Data Center Heat Exchangers

Stable liquid cooling with defensible redundancy.

Application engineering

Start with the process—not a catalogue model.

High-density computing shifts the thermal challenge from room air to liquid loops. HEXNOVAS engineers the isolation interface around coolant compatibility, approach temperature, pressure drop, redundancy, cleanliness and maintainability.

Direct-to-chip liquid cooling

High-efficiency facility-water isolation for CDU secondary loops serving cold plates and rack manifolds.

Immersion cooling

Fluid-to-water heat rejection for single- and two-phase immersion architectures.

Free cooling

Use ambient or cooling-tower conditions to reduce mechanical refrigeration hours.

Data center heat reuse

Transfer recoverable server heat into district energy, building heating or heat-pump systems.

Application coverage

Processes and systems covered by this sector.

These established HEXNOVAS application areas are retained from the original website and reorganized here for clearer technical selection.

Liquid-cooled server racks
Immersion cooling systems
Air-handling-unit heat recovery
Data-center chilled-water loops

Selection basis

Information that determines the right exchanger.

A reliable selection requires the complete operating case, not only heat duty. These factors are reviewed together before model sizing.

IT load and future rack-density growth
Coolant chemistry and material compatibility
Approach temperature at peak ambient condition
Redundancy, isolation and leak-risk strategy
Pressure drop, cleanliness and filtration

Technology fit

Products commonly used in this application.

The final technology depends on media, pressure, temperature, fouling, cleaning and lifecycle requirements.

HEXNOVAS Standard Gasketed Plate Heat Exchangers

Engineering support

Send the operating conditions. We will evaluate the technology.

Contact HEXNOVAS