Industry application
Data Center Heat Exchangers
Heat exchangers for data center liquid cooling, coolant distribution units, immersion cooling, chilled-water loops and heat recovery.
Prepare Your Selection Request
Application engineering
Process Role
A coolant distribution unit (CDU) transfers server heat from the IT coolant circuit to facility water. In direct-to-chip systems, the secondary loop serves cold plates and rack manifolds; the exchanger sets the temperature difference and hydraulic resistance between that loop and the facility circuit.
Immersion systems need an interface matched to the immersion fluid and whether heat is carried by a liquid stream or condensing vapor. Facility water may reject heat through chilled water or a free-cooling arrangement, or supply a heat-reuse system. These interfaces should be rated as separate duties rather than assigned one nominal server-load figure.
Thermal interfaces
Typical Thermal Duties
CDU and direct-to-chip interfaces
Rate the IT-side outlet temperature against the facility inlet at peak load and part load. Include coolant properties and the pressure-drop allowance left after cold plates, manifolds and piping.
Immersion and facility loops
Specify the actual immersion fluid, phase state and compatible wetted materials. Distinguish an immersion-fluid exchanger from the downstream water-to-water interface.
Free cooling and heat reuse
Available ambient conditions, facility supply temperature and exchanger approach determine free-cooling feasibility. Useful heat export also needs a simultaneous sink at a compatible temperature; it is not an automatic energy-saving percentage.
Rating basis
Key Engineering Inputs
- IT-side coolant formulation and concentration; facility-side water or glycol properties and cleanliness.
- Flow and inlet/outlet temperatures on both sides, with peak, part-load and future expansion cases.
- Operating and design pressure, allowable pressure drop, required approach and connection constraints.
- Redundancy philosophy, isolation valves, leak detection and containment requirements for the actual architecture.
Design review
Application-Specific Design Challenges
Temperature approach and pumping allowance
A closer approach increases the required thermal conductance. Adding parallel channels can alter velocity and distribution, so thermal size and pump head need to be checked together. Redundant units must be evaluated at the flow they actually receive when equipment is isolated.
Coolant compatibility and containment
Fluid separation does not itself provide electrical isolation. Any dielectric requirement belongs to a separate system assessment. Review metals, joining materials, seals, contaminants, filtration and service access with the coolant supplier; a copper-free unit is not automatically compatible with every formulation.
Published Evidence Scope
No direct data-center project is identified in the published HEXNOVAS case set reviewed for this page. The duty descriptions above are application guidance, not installation results.
Technology fit
Common Heat Exchanger Technologies
Brazed plate
A candidate for packaged CDUs where coolant compatibility, pressure rating and sealed-core maintenance fit the system.
Gasketed plate
An openable option for facility water where inspection and cleaning access matter; confirm seals and channel allocation.
Stainless fusion-bonded
Consider where copper contact is unsuitable, after checking the actual bonding materials and coolant conditions.
Prepare your enquiry
What HEXNOVAS Needs for Selection
- Send the coolant datasheet and a loop diagram identifying the CDU, facility supply and heat-rejection or reuse equipment.
- Provide duty, both flow rates, temperature targets and separate pressure-drop budgets for normal and redundant operation.
- Identify cleanliness, leak-detection, connection and service-access requirements, plus the planned expansion case.
Engineering support